Semiconductors

Specializing in the high-tech manufacturing sector, the team provides comprehensive solutions for the planning, design and execution of semiconductor fabrication and packaging facilities. With expertise in ultra-clean environments, precision engineering and adherence to global compliance standards, we deliver advanced semiconductor infrastructure that meets the industry's most rigorous demands.

Our team integrates leading-edge technologies with global best practices to deliver facilities that meet the rigorous standards of the semiconductor industry. From cleanroom design and process utility integration to vibration control and contamination prevention, we engineer every element to support high-yield, scalable production.

Facility Experience Includes:

• Wafer Fabrication Plants (Fab)
• Outsourced Semiconductor Assembly & Test Facilities (OSAT)
• Photolithography & Etching Cleanrooms
• Chip Packaging & Bumping Units
• Design & R&D Centers for Semiconductor Innovation
• Class 1 to Class 1000 Cleanroom Infrastructure
• Ultra-Pure Water (UPW) Systems
• Specialized HVAC, Vibration Isolation & EMI Shielding